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Reliability Test Conditions(AEC-Q200)
Item Required Characteristics Test Method / Condition

High Temperature Storage

Reference documents:

MIL-STD-202G Method 108

(Sample Size:77PCS )

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/ΔCR≦10%

Temperature: N℃ (N: Follow the product specification for the setting.)

1000 hrs. at rated operating temperature (e.g. 125°C part can be stored for 1000 hrs. @ 125°C. Same applies for 105°C and 85°C.Unpowered. Measurement at 24±4 hours after test conclusion.

Temperature Cycling

Reference documents:

JESD22 Method JA-104

(Sample Size:77PCS )

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/ΔCR≦10%

Temperature: N℃ (N: Follow the product specification for the setting.)

1000 cycles (-40°C to +125°C). Note: If 85°C part or 105°C part the 1000 cycles will be at that temperature. Measurement at 24±4 hours after test conclusion. 30min maximum dwell time at each temperature extreme. 1min. maximum transition time.

Biased Humidity

Reference documents:

MIL-STD-202G Method 103

(Sample Size:77PCS )

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/ΔCR≦10%

1000 hours 85°C/85%RH. Unpowered. Measurement at 24±4 hours after test conclusion.

Operational Life

Reference documents:

MIL-PRF-27

(Sample Size:77PCS )

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/ΔCR≦10%

1000 hrs. @ 105°C. If 125°C or 155°C parts should be tested at the temperature specified. Measurement at 24±4 hours after test conclusion.

External Visual

Reference documents:

MIL-STD-883 Method 2009

(All Samples)

Electrical Test not required.

Inspect device construction, marking and workmanship

Physical Dimension

Reference documents:

JESD22 Method JB-100

(Sample Size:30PCS)

Electrical Test not required.

Verify physical dimensions to the applicable device detail specification. Note: User(s) and Suppliers spec. Electrical Test not required.

Electrical Characterization

Reference documents:

User Spec.

(Sample Size: 30 PCS )

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/ΔCR≦10%

Parametrically test sample size requirements,summary to show Min, Max, Mean and Standard deviation at room as well as Min and Max operating temperatures.

Terminal Strength

(Leaded)

Reference documents:

MIL-STD-202 Method 211

(Sample Size:30PCS )

No significant defects in appearance.

Test leaded device lead integrity only. Conditions: A (910 g), C (1.13kg), E (1.45 kg-mm)

Mechanical Shock

Reference documents:

MIL-STD-202Method 213

(Sample Size:30PCS )

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/ΔCR≦10%

Condition C:PGA: 100g.s; Duration: 6ms; Using half-sine waveform with max velocity change of 12.3ft/sec

Vibration test

Reference documents:

MIL-STD-202 Method 204

(Sample Size:30PCS )

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/ΔCR≦10%

Test from 10-2000 Hz.5g's for 20 minutes, 12 cycles each of 3 orientations .

Resistance to Soldering Heat

Reference documents:

MIL-STD-202Method 210

(Sample Size:30PCS )

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/ΔCR≦10%

1.The Leaded :

No pre-heat of samples. Leaded with solder within 1.5mm of device body for 10 seconds(260+0/-5℃).

2.The SMD:

A:Refer to the below reflow curve and go through the reflow for twice.

B:The peak temperature : 260+0/-5℃;

C:The reflow test conditions are based on the testing instruments available in 3L

Solderability

Reference documents:

IPC J-STD-002D

(Sample Size: 15PCS )

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/ΔCR≦10%

1.Steam aging: 8 hours; (93℃)

2.In solder pot at 245±5°C for 5 second

Board Flex

Reference documents:

AEC-Q200-005

(Sample Size: 30 PCS )

No significant defects in appearance.

The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum (or as defined in the customer specification or Q200). The duration of the applied forces shall be 60 (+ 5) Sec. The force is to be applied only once to the board.

Terminal Strength

(SMD)

Reference documents:

AEC-Q200-006

(Sample Size: 30 PCS )

No significant defects in appearance.

apply a 17.7N (1.8Kg) force to the side of a device being tested. This force shall be applied for 60( +1) seconds.

Resistance to Solvents

Reference documents:

MIL-STD- 202 Method 215

(Sample Size:5PCS )

No significant defects in appearance.

Note: Add Aqueous wash chemical. OKEM Clean or equivalent. Do not use banned solvents.

Application Notice:

1. Storage Conditions

To maintain the solderability of terminal electrodes:

(1) Temperature and humidity conditions : <35℃ and < 35~65%RH

(2) Recommendation: inductors should be used within 6 months from the time of delivery.

(3) Packaging material should be kept away from where chlorine or sulfur exists.

2. Soldering

(1) Lead-free the recommended reflow condition (SMT TYP)

Add:

The recommended reflow conditions as left graph, is set according to our soldering equipment, due to various manufacturers may have different reflow soldering equipments, products, process conditions, set methods .. and so on, when setting the reflow conditions, Please adjust and confirm according to users' environment / equipments.

(2) Lead-free the recommended Wave soldering (DIP TYP)

Add:

Left recommended Wave soldering, is a reference to a single wave soldering recommended by the manufacturer, because the various manufacturers of soldering equipment, product process conditions, set way .. and so on, are very different, so setting the Wave soldering conditions, Please adjust and confirm according to users' environment / equipments.

(3) Soldering Iron

(1) Use a soldering iron to solder inductors by hand, time does not exceed 350 degrees 3 seconds.

(2) When soldering iron welding, please try to avoid contacting the inductor itself. (definitely do not contact the wire)

(3) To solder inductors by soldering iron is not recommended.

3. Precautions

(1) When using our inductors, please carry out product assembling test and evaluation of product operating environment.

(2) Non-magnetic shielded inductors, when design circuit, should pay attention to its space allocation in order to avoid electromagnetic interference which can cause malfunctions.

(3) Do not place inductors near magnet or any magnetic objects.

(4) Do not use or store inductors in a corrosive gas environment. (example: salt, sulfur, acid, etc ..).

(5) The catalogue specification for reference only. Please check the official specification from 3L datasheet as approved.

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