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Item Required Characteristics Test Method / Condition

High Temperature Storage Test

Reference Documents:

MIL-STD-202G Method 108A

1.No significant defects in appearance.

2.ΔL/L≦10%

3.ΔQ/Q≦30% (Only SMD series)

4.ΔDCR/DCR≦10%

Temperature: N±2℃ (N: Follow the product specification for the setting.)

Time : 96±2 hours

Place the samples for one hour at room temperature and test them within two hours.

Low Temperature Storage Test

Reference Documents:

IEC 68-2-1A

1.No significant defects in appearance.

2.ΔL/L≦10%

3.ΔQ/Q≦30% (Only SMD series)

4.ΔDCR/DCR≦10%

Temperature: M±2℃ (M: Follow the product specification for the setting)

Time : 96±2 hours

Place the samples for one hour at room temperature and test them within two hours.

Humidity Test

Reference Documents:

MIL-STD-202G Method 103B

1.No significant defects in appearance.

2.ΔL/L≦10% (Mn,Zn: ΔL/L≦30% )

3.ΔQ/Q≦30%

4.ΔDCR/DCR≦10%

Temperature: 40±2℃ , Humidity: 93±3%RH

Time : 96±2 hours

Place the samples for one hour at room temperature and test them within two hours.

Thermal Shock Test

Reference Documents:

MIL-STD-202G Method 107G

1.No significant defects in appearance.

2.ΔL/L≦10% (Mn,Zn: ΔL/L≦30% )

3.ΔQ/Q≦30%

4.ΔDCR/DCR≦10%

T: 15Min if weight≦28g M: low temp. setting

T: 30Min if 28g≦weight≦136g N: high temp. setting

Start at M℃ for T time, rush to N ℃ for T time as one cycle, go through 20 cycles.

Solderability Test

Reference Documents:

MIL-STD-202G Method 208H

IPC J-STD-002D

Terminals must have 95% minimum solder coverage.

1.Dip pads in flux then dip in solder pot at 245±5°C for 5 second.

2.Solder: lead free

3.Flux: rosin flux

Heat endurance of flow soldering

Reference documents:

MIL-STD-202G Method 210F

SMT Type*

1.No significant defects in appearance.

2.ΔL/L≦10% (Mn,Zn: ΔL/L≦30% )

3.ΔQ/Q≦30%

4.ΔDCR/DCR≦10%

1.Refer to the above reflow curve and go through the reflow for twice.

2.The peak temperature : 260+0/-5℃

3.The reflow test conditions are based on the testing

instruments available in 3L

Heat endurance of flow soldering

Reference documents:

MIL-STD-202G Method 210F

DIP Type*

1.No case deformation or change in appearance.

2.ΔL/L≦10%

3.ΔQ/Q≦30%

4.ΔDCR/DCR≦10%

1.Dip in solder pot at 260+0/-5℃ for 10 second.

2.Solder: lead free

Vibration test

Reference documents:

MIL-STD-202G Method 201A

1.No significant defects in appearance.

2.No short and no open.

Apply frequency 10~55~10Hz and amplitude 1.5mm, 1 min/cycle in X 􁇬 Y and Z direction for 2 hours each. (total 6 hours)

Drop test

Reference documents:

IEC-68-2-32

1.No case deformation or change in appearance.

2.No short and no open.

Drop the packaged products from 1m high in 1 angle,3 ridges and 6 surfaces, twice in each direction.

Terminal strength push test

Reference documents:

IEC 68-2-21:1992

SMT Type*

1. HPI / SMD(V) / SMB / SMI / SMW series:Applied force:5N Duration: 10sec

2.Other SMT series besides the above series:Applied force:10N Duration: 10sec

3.Solder paste thickness:0.12mm

4.Meet the above requirements without any loose terminal.

Solder the test samples to the PCB through245 ℃ reflow, apply a standard force on the side of the test samples for 10 seconds.

Terminal strength

Reference documents:

IEC 68-2-21:1992 Test A & C

DIP Type*

1.Terminal should not loose

2.Meet require test condition A & C

A.Pull Force:0.45kg;the force shall be applied gradually to the terminal and then maintained for 10 seconds.

C. Wire-lead bend:0.23kg,The rate of bending shall be approximately 3 seconds per bend in each direction.The load shall be suspended at a point within 1/4 inch from the free end of the terminal.

Resistance to solvent test

Reference documents:

IEC 68-2-45:1993

No damage in appearance or marking

Dip parts into IPA solvent for 5±0.5Min, dry them at room temp for 5Min, then brush them for 10 times

Electronic characteristic test of major products

Refer to catalogue of specific products

Refer to catalogue of specific products

Overload test

Reference documents:

JIS C5311-6.13

1. No significant defects in appearance.

2.ΔL/L≦10%

3.ΔQ/Q≦30%

4.ΔDCR/DCR≦10%

Apply twice as rated current for 5 minutes

voltage resistance test

Reference documents:

MIL-STD-202G Method 301

1.During the test no breakdown

2.The characteristic is normal after test

DIP Type*

Refer to product’s specification

SMT Type*

1.For parts with two coils

2.DC1000V,Current:1mA,Time:1Min.

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