Item	Required Characteristics	Test Method / Condition
High Temperature Storage Reference documents: MIL-STD-202G Method 108	1. No significant defects in appearance. 2. ΔL/L≦10% 3. ΔDCR/DCR≦10%	Temperature: N℃ (N: Follow the product specification for the setting.) 1000 hrs. at rated operating temperature (e.g. 125°C part can be stored for 1000 hrs. @ 125°C. Same applies for 105°C and 85°C.Unpowered. Measurement at 24±4 hours after test conclusion.
Temperature Cycling Reference documents: JESD22 Method JA-104	1. No significant defects in appearance. 2. ΔL/L≦10% 3. ΔDCR/DCR≦10%	Temperature: N℃ (N: Follow the product specification for the setting.) 1000 cycles (-40°C to +125°C). Note: If 85°C part or 105°C part the 1000 cycles will be at that temperature. Measurement at 24±4 hours after test conclusion. 30min maximum dwell time at each temperature extreme. 1min. maximum transition time.
Biased Humidity Reference documents: MIL-STD-202G Method 103	1. No significant defects in appearance. 2. ΔL/L≦10% 3. ΔDCR/DCR≦10%	1000 hours 85°C/85%RH. Unpowered. Measurement at 24±4 hours after test conclusion.
Operational Life Reference documents: MIL-PRF-27	1. No significant defects in appearance. 2. ΔL/L≦10% 3. ΔDCR/DCR≦10%	1000 hrs. @ 105°C. If 125°C or 155°C parts should be tested at the temperature specified. Measurement at 24±4 hours after test conclusion.
Terminal Strength (Leaded) Reference documents: MIL-STD-202 Method 211	No significant defects in appearance.	Test leaded device lead integrity only. Conditions: A (910 g), C (1.13kg), E (1.45 kg-mm)
Mechanical Shock Reference documents: MIL-STD-202 Method 213	1. No significant defects in appearance. 2. ΔL/L≦10% 3. ΔDCR/DCR≦10%	Condition C：PGA: 100g.s; Duration: 6ms; Using half-sine waveform with max velocity change of 12.3ft/sec
Vibration test Reference documents: MIL-STD-202 Method 204	1. No significant defects in appearance. 2. ΔL/L≦10% 3. ΔDCR/DCR≦10%	Test from 10-2000 Hz.5g's for 20 minutes, 12 cycles each of 3 orientations .
Resistance to Soldering Heat Reference documents: MIL-STD-202 Method 210	1. No significant defects in appearance. 2. ΔL/L≦10% 3. ΔDCR/DCR≦10%	1.The Leaded : No pre-heat of samples. Leaded with solder within 1.5mm of device body for 10 seconds(260+0/-5℃). 2.The SMD： A：Refer to the below reflow curve and go through the reflow for twice. B：The peak temperature : 260+0/-5℃; C：The reflow test conditions are based on the testing instruments available in 3L
Solderability Reference documents: IPC J-STD-002D	1. No significant defects in appearance. 2. ΔL/L≦10% 3. ΔDCR/DCR≦10%	1.Steam aging: 8 hours; (93℃) 2.In solder pot at 245±5°C for 5 second
Board Flex Reference documents: AEC-Q200-005	No significant defects in appearance.	The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum (or as defined in the customer specification or Q200). The duration of the applied forces shall be 60 (+ 5) Sec. The force is to be applied only once to the board.
Terminal Strength (SMD) Reference documents: AEC-Q200-006	No significant defects in appearance.	apply a 17.7N (1.8Kg) force to the side of a device being tested. This force shall be applied for 60( +1) seconds.
Resistance to Solvents Reference documents: MIL-STD- 202 Method 215	No significant defects in appearance.	Note: Add Aqueous wash chemical. OKEM Clean or equivalent. Do not use banned solvents.
External Visual Reference documents: MIL-STD-883 Method 2009	Electrical Test not required.	Inspect device construction, marking and workmanship
Physical Dimension Reference documents: JESD22 Method JB-100	Electrical Test not required.	Verify physical dimensions to the applicable device detail specification. Note: User(s) and Suppliers spec. Electrical Test not required.
Electrical Characterization Reference documents: User Spec.	1. No significant defects in appearance. 2. ΔL/L≦10% 3. ΔDCR/DCR≦10%	Parametrically test sample size requirements,summary to show Min, Max, Mean and Standard deviation at room as well as Min and Max operating temperatures.

Item

Required Characteristics

Test Method / Condition

High Temperature Storage

Reference documents:

MIL-STD-202G Method 108

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/DCR≦10%

Temperature: N℃ (N: Follow the product specification for the setting.)

1000 hrs. at rated operating temperature (e.g. 125°C part can be stored for 1000 hrs. @ 125°C. Same applies for 105°C and 85°C.Unpowered. Measurement at 24±4 hours after test conclusion.

Temperature Cycling

Reference documents:

JESD22 Method JA-104

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/DCR≦10%

Temperature: N℃ (N: Follow the product specification for the setting.)

1000 cycles (-40°C to +125°C). Note: If 85°C part or 105°C part the 1000 cycles will be at that temperature. Measurement at 24±4 hours after test conclusion. 30min maximum dwell time at each temperature extreme. 1min. maximum transition time.

Biased Humidity

Reference documents:

MIL-STD-202G Method 103

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/DCR≦10%

1000 hours 85°C/85%RH. Unpowered. Measurement at 24±4 hours after test conclusion.

Operational Life

Reference documents:

MIL-PRF-27

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/DCR≦10%

1000 hrs. @ 105°C. If 125°C or 155°C parts should be tested at the temperature specified. Measurement at 24±4 hours after test conclusion.

Terminal Strength

(Leaded)

Reference documents:

MIL-STD-202 Method 211

No significant defects in appearance.

Test leaded device lead integrity only. Conditions: A (910 g), C (1.13kg), E (1.45 kg-mm)

Mechanical Shock

Reference documents:

MIL-STD-202 Method 213

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/DCR≦10%

Condition C：PGA: 100g.s; Duration: 6ms; Using half-sine waveform with max velocity change of 12.3ft/sec

Vibration test

Reference documents:

MIL-STD-202 Method 204

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/DCR≦10%

Test from 10-2000 Hz.5g's for 20 minutes, 12 cycles each of 3 orientations .

Resistance to Soldering Heat

Reference documents:

MIL-STD-202 Method 210

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/DCR≦10%

1.The Leaded :

No pre-heat of samples. Leaded with solder within 1.5mm of device body for 10 seconds(260+0/-5℃).

2.The SMD：

A：Refer to the below reflow curve and go through the reflow for twice.

B：The peak temperature : 260+0/-5℃;

C：The reflow test conditions are based on the testing instruments available in 3L

Solderability

Reference documents:

IPC J-STD-002D

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/DCR≦10%

1.Steam aging: 8 hours; (93℃)

2.In solder pot at 245±5°C for 5 second

Board Flex

Reference documents:

AEC-Q200-005

No significant defects in appearance.

The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum (or as defined in the customer specification or Q200). The duration of the applied forces shall be 60 (+ 5) Sec. The force is to be applied only once to the board.

Terminal Strength

(SMD)

Reference documents:

AEC-Q200-006

No significant defects in appearance.

apply a 17.7N (1.8Kg) force to the side of a device being tested. This force shall be applied for 60( +1) seconds.

Resistance to Solvents

Reference documents:

MIL-STD- 202 Method 215

No significant defects in appearance.

Note: Add Aqueous wash chemical. OKEM Clean or equivalent. Do not use banned solvents.

External Visual

Reference documents:

MIL-STD-883 Method 2009

Electrical Test not required.

Inspect device construction, marking and workmanship

Physical Dimension

Reference documents:

JESD22 Method JB-100

Electrical Test not required.

Verify physical dimensions to the applicable device detail specification. Note: User(s) and Suppliers spec. Electrical Test not required.

Electrical Characterization

Reference documents:

User Spec.

1. No significant defects in appearance.

2. ΔL/L≦10%

3. ΔDCR/DCR≦10%

Parametrically test sample size requirements,summary to show Min, Max, Mean and Standard deviation at room as well as Min and Max operating temperatures.

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