RELIABILITY TEST CONDITIONS
WIRE WOUND CHIP INDUCTORS TYPE
FOR SMD322522/453232 / SMTSDR322520/453226 / SMDCHGR0603/0805/1008/1210 / SMDFSR1008 / SMTSC

Item (項目)

Required Characteristics (要求)

Test Method/Condition (測試方法)

Solderability test
Reference documents:
MIL-STD-202G Method 208H
IPC J-STD-002B

可焊性測試

Terminals area must have
95% min.

Solder coverage

端子必須有95%以上著錫

• Dip pads in flux then dip in
  solder pot at 245±5°C for 5 second.
• Soler: Sn(93.5)/Ag(3.5)
• Flux: rosin flux
• 端子侵入著焊劑，然後侵入
  245±5°C 錫爐中5秒
• 焊料 :Sn(93.5)/Ag(3.5)
• 助焊劑: 松香助焊劑

Heat endurance of Reflow soldering

Reference documents:

IPC J-STD-020B

過再流焊測試

• No case deformation or change in appearance.
• ΔL/L≦10%
• ΔQ/Q≦30%
• ΔDCR/DCR≦10%
  
• 無明顯的外觀缺陷
• 感值變化不超過10%
• 品質因不變化不超過30%
• 直流電阻變化不超過10%

• Refer to the next page
  reflow curve Gothrough
  3 times
• The peak temperature : 245±5°C
  
• 參照下頁回流焊曲線過三次
• 峰值溫度為: 245±5°C

Vibration test

Reference documents:

MIL-STD-202G Method 201A

振動測試

1.No case deformation or
change in appearance.
2.ΔL/L≦10%
3.ΔQ/Q≦30%
4.ΔDCR/DCR≦10%

1.無明顯的外觀缺陷
2.感值變化不超過10%
3.品質因數變化不超過30%
4.直流電阻變化不超過10%

Apply frequency 10~55Hz. 0.75mm
amplitude in each of perpendicular
direction for 2 hours.(total 6 hours)

用10~55Hz 振動頻率0.75mm振幅沿X,Y,Z方向各
振動2小時.(共6小時)

Drop test

Reference documents:

MIL-STD-202G Method 203C

落下試驗

1.No case deformation or
change in appearance.
2.ΔL/L≦10%
3.ΔQ/Q≦30%
4.ΔDCR/DCR≦10%
For T: weight≦28g : 15Min; 28g≦weight≦136g : 30Min

1.無明顯的外觀缺陷
2.感值變化小於10%
3.品質因數變化小於30%
4.直流電阻變化小於10%

Packaged & Drop down from
1m with 981m/s2(100G) a
ttitude In 1 angle 1
ridges & 2 surfaces orientations.

將產品包裝後從1米高度自然落下
至試驗板上

Terminal strength push test

Reference documents:

JIS C 5321:1997
端子強度試驗

Pulling test:
DEFINE: A: sectional area
of terminal
A≦8 (Sq M)
force≧5N time:30sec
8(Sq M) <A≦20(Sq M)
force ≧10N time : 10sec
20(Sq M) <A force ≧20 N time: 10sec

Bending test:
Soldering the products on
PCB,after the pulling testand bending test ,terminal should
not pull off
定義: A: 焊接端子截面積
A≦8(Sq M)
推力≧5牛頓時間: 30秒
8(Sq M) <A≦20(Sq M)
推力≧10牛頓時間: 10秒
彎折測試:
將產品焊於PCB上,分別經過推力
測試和彎折
測試後,端子不會發生松脫

Bend the testing PCB at middle point,the deflection shall be 2mm






將PCB對中彎折,到達撓度2mm

Resistance to solvent test
Reference documents:

IEC 68-2-45:1993
耐溶劑性試驗

No case deformation or
change in appearance,or
obliteration of marking

無外觀破壞及標記破損

To dip parts into IPA solvent for 5±0.5Min,
then drying them atroom temp for 5Min,at
last ,to brushing making 10 times.
在IPA溶劑中浸泡 5±0.5分鐘,室溫下乾燥5分鐘,然後擦
拭10次.