Our Company

Technical Roadmap 1977~2010

1977 3L Electronic Corp. in Taipei, Taiwan Established .

1983 Approved by Taiwan Military Service for Inductor & Coil Products.

1989 Set up first China factory in Zhuhai, Guangdong. Introduced firstly the Conformal Coated Inductors (Color Code Inductors) in Taiwan Market & fully adapted auto production equipment to achieve low cost/high volume requirement , Formed Technology team for Molding/Manufacturing, Equipments/Production tooling Development.

1990 Integrated & Focused on Winding Inductor & coil products. Adapted CNC winding machines for High Inductance/Low Frequency applications.

1992 Firstly Introduced High Frequency Molding Coils. Integrated Ferrite & Iron Powder core suppliers near by 3L’s location for Raw Material Development.

1993 Developed Full line Iron Powder Chokes & High Flux/MPP Choke production lines, Founded a new factory.

1994 Adapted automatic Toroid winding machines for high-turns requirement applications & automatic Wire Stripping Process for Bold wire applications.

1995 Began to produce Ceramic Drum Core. Adapted Radial Inductor automatic Taping machines & High-Speed Bead Assembling lines.

1996 Introduced SMT Power Inductor / SMD Winding Chip Products in Global Market.

1998 Firstly Introduced Lead Free SMT Toroid choke process for Texas Instrument Inc. Introduced Ceramic Winding Chip inductor for Cellular phone / wireless communication business.

1999 Introduced Molded Winding Ferrite Chips series (SMD32/45/56/63) in Market. Used Spot Soldering Technology on high reliability required Thin Wire applications. (Compact Structure Design)

2000 Introduced Various Low-Profile Shielded Power Choke applications in Global Market. Adapted Electric Plating for Terminal Processing to increase soldering reliability.

2001 Minimized dimensions for all SMT/SMD series. Adapted High-Speed Pin Attaching Machines for Dip type product application. (220 pcs/ min). Developed Multilayer Bead/ Inductor products.

2002 Setup a complete Reliability Test Lab in New factory which containing Heat Shock Simulator, High Temp/Humidity Test Chamber, Salt Water Spraying Tester, Vibration Test machine, Drop Test Machine, Push/Pull Strength for X-Y-Z Axial Test Machine, Peeling Strength Tester for SMT/SMD Reel Packaging, Nitrogen Reflow Soldering Machine, Simulated SMT assembly line, Density Tester, Hi-Pot Tester, X-Ray Material Analyzer etc.. Formed the fully automatic production lines for SMTSDR production lines; Simultaneously Promoted 5S Exercise and Developed Lead Free/RoHS products.

2002 Started to develop Planar Transformer ,and now manufacture in large scale with transformer’s power from dozens to hundreds watts , working frequency range up to 900KHz ,Winding consisting of dozens of layers PCB, and type including :EI14,EE18,EI22,ER15,ER18,ER25,EQ30 and etc .

2003 Formed fully automatic production lines of Flat Wire Power Choke (SMTER, SMTBW Series) for CPU application. Developed Low Profile SMT Power Choke (SMTDRRI2D/3D/4D/5D) / Common Mode choke (SMDWCM) applications. Developed Balance Score Card (BSC) Strategic Management system in 3L. Adapted Gauge R&R /MSA /SPC /FMEA /PPAP/ APQP tools in 3L. Setup a new branch in Su Zhou for future Expansion. Developed Thin Film / Ceramic Miniature Multilayer products. Produced Aluminum/ Copper cores in house.

2004 Developed Whole Terminal Plating production including Ag/Ni/Sn Layer processing, Expanded Molded Base Production lines for further decreasing Raw Material Costs. Began to produce Planar Xfmrs. Developed High Speed Winding /Soldering/ Terminal treating machine (0.6 sec/pcs) and Fully automated Marking /Testing /Packaging machines (0.5 sec/pcs) for winding chip product. Purchased a new land of 48,000 Square Meter in Cui Heng, Zhong Shan for future factory expandation. Developed LTCC associated products (High/Low Pass Filter, Duplex, Balun, Antenna)

2005 Developed Lowest profile power choke (0.8mm Height) and various miniature power choke products for most state of the art portable products. Integrated automatic production line and raised winding chips capacity to 20 Million. Executed Blue Sea Strategy on developing new application area. Awarded ISO14000 and GPMS Certificate. Opened new factory for Electric Plating.

2006 Switched all 3L products into RoHS complied products. Successfully Finished Design Stages for BRI (Low Profile Power Chokes produced by 100% Automation Lines), SMDV (Molded Winding Chips), SMTPI (Molded Iron Powder Power Chokes), Planar Xfmrs products. Achieved 9,000,000 Monthly capacity for SMTSDR winding chip series.

2007 Developed Low profile High current/Molded Power Chokes. Expanded SMDV series to 25/20 series & Magnetic Epoxy packaging. Expanded BRI series to lowest profile as 0.7mm. & wider application for unshielded type & magnetic epoxy packaging type.

2008 Awarded Sony GP and QC080000 certificate ,Started to develop molded iron powder high DC current inductor (DIP and SMD type) for CPU power choke application ,SMD type including UPIA/UPIB/UPIC. Type UPIA working frequency up to 1MHz , 3MHz for UPIC ,5MHz for UPIB ; DIP type including HFPI type for high frequency /high current Power choke application .

2009 Start mass production for molded iron powder high current inductor ,which SMD type ranges UPIA0603/0604/1004/1005/1203/1205/1207 ,and which DIP includes DPI1210. Developed open magnetic circuit BDR series inductor for lower power choke ,by auto-production. Developed BDE series inductor with outline painting magnetic resin ,by auto-production. Developed high DC current power choke HCL1310 ,featuring lowest DCR with copper foil winding .

2010 Developed side welding low profile power choke series (down to 1mm height), SVL. This series has much better performance than 3L all old series' low profile power chokes due to the structure change with side welding & enlarged ferrite. Developed Ultra low profile Iron powder molded inductor series, UPI 0412 (Height is only 1.2mm with 4X4 mm dimension) and successfully supported Texas Instrument Module integration project.

Edited by Weiyang Liu & William Chen